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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11541653
Filing Dt:
10/03/2006
Publication #:
Pub Dt:
02/01/2007
Inventors:
Noboru Gotou, Takayuki Nishiura, Osamu Ohama
Title:
Container, a packaging body, manufacturing method of a container, manufacturing method of a packaging body, and a compound semiconductor substrate
Assignment: 1
Reel/Frame:
018381/0718Recorded: 10/03/2006Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/12/2006
Exec Dt:
09/12/2006
Exec Dt:
09/12/2006
Assignee:
5-33, KITAHAMA 4-CHOME, CHUO-KU
OSAKA-SHI, OSAKA 541-0041, JAPAN
Correspondent:
MCDERMOTT WILL & EMERY LLP
600 13TH STREET, N.W.
WASHINGTON, D.C. 20005-3096

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