Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10838572
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Filing Dt:
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05/05/2004
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Publication #:
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Pub Dt:
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02/08/2007
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Inventors:
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Hitoshi Kurumizaka, Wataru Kagawa, Shigeyuki Yokoyama
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Title:
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Three-dimensional structure of DNA recombination/repair protein and use thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1, HIROSAWA, SAITAMA 351-0198 |
| WAKO-SHI, JAPAN |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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