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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11448314
Filing Dt:
06/07/2006
Publication #:
Pub Dt:
02/15/2007
Inventors:
Steven Webster, Ying-Cheng Wu
Title:
Image sensor chip package
Assignment: 1
Reel/Frame:
017962/0509Recorded: 06/07/2006Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/26/2006
Exec Dt:
05/26/2006
Assignee:
3F, NO. 16 KE-JUNG ROAD
SCIENCE-BASED INDUSTRIAL PARK CHU-NAN
MIAO-LI HSIEN 350, TAIWAN R.O.C.
Correspondent:
JEFFREY T. KNAPP
PCE INDUSTRY, INC.
458 E. LAMBERT RD.
FULLERTON, CA 92835

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