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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11207886
Filing Dt:
08/22/2005
Publication #:
Pub Dt:
02/22/2007
Inventors:
Pei-Haw Tsao, Frank Wu, Chung-Yi Lin
Title:
Thermally enhanced cavity down ball grid array package
Assignment: 1
Reel/Frame:
017051/0248Recorded: 11/22/2005Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/18/2005
Exec Dt:
08/18/2005
Exec Dt:
08/18/2005
Assignee:
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
JOE MCKINNEY MUNCY
BIRCH, STEWART, KOLASCH & BIRCH, LLP
8110 GATEHOUSE ROAD, SUITE 100 EAST
P.O. BOX 747
FALLS CHURCH, VA 22040-0747

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