Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/04/2008
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Application #:
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11217978
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Filing Dt:
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08/31/2005
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Publication #:
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Pub Dt:
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03/01/2007
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Inventors:
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Chun-Hung Lin, Geng-Shin Shen
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Title:
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CHIP PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN R.O.C. |
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J.C. PATENTS |
4 VENTURE, SUITE 250 |
IRVINE, CA 92618 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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CANON'S COURT |
22 VICTORIS STREET |
HAMILTON HM12, BERMUDA |
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J. C. PATENTS |
4 VENTURE, SUITE 250 |
IRVINE, CA 92618 |
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