Patent Assignment Abstract of Title
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Total Assignments:
5
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Patent #:
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Issue Dt:
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05/31/2011
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Application #:
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11552110
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Filing Dt:
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10/23/2006
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Publication #:
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Pub Dt:
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03/01/2007
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Inventors:
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Sammy Mok, Fu Chiung Chong
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Title:
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CONSTRUCTION STRUCTURES AND MANUFACTURING PROCESSES FOR INTEGRATED CIRCUIT WAFER PROBE CARD ASSEMBLIES
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Assignment:
1
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LIEN (SEE DOCUMENT FOR DETAILS).
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3475 EDISON WAY, SUITE L |
MENLO PARK, CALIFORNIA 94025 |
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GLENN PATENT GROUP |
3475 EDISON WAY, SUITE L |
MENLO PARK, CA 94025 |
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Assignment:
2
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P.O. BOX 640100 |
SAN JOSE, CALIFORNIA 95164 |
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GLENN PATENT GROUP |
3475 EDISON WAY, SUITE L |
MENLO PARK, CA 94025 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1100 LA AVENIDA STREET |
BUILDING A |
MOUNTAIN VIEW, CALIFORNIA 94043 |
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GREGORY W. OSTERLOTH |
P.O. BOX 8749 |
DENVER, CO 80201 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 1 YISHUN AVENUE 7 |
SINGAPORE, SINGAPORE 768923 |
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GREGORY W. OSTERLOTH |
P.O. BOX 8749 |
DENVER, CO 80201 |
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Assignment:
5
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1, YISHUN AVENUE 7 |
SINGAPORE, SINGAPORE 768923 |
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GREGORY W. OSTERLOTH |
555 17TH STREET, SUITE 3200 |
DENVER, CO 80202 |
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