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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
7622803
Issue Dt:
11/24/2009
Application #:
11467040
Filing Dt:
08/24/2006
Publication #:
20070047204
Pub Dt:
03/01/2007
Inventors:
Winston T. Parker, Van Mieczowski, Jim Wood, David Emerson, Daniel Cronin
Title:
HEAT SINK ASSEMBLY AND RELATED METHODS FOR SEMICONDUCTOR VACUUM PROCESSING SYSTEMS
Assignment: 1
Reel/Frame:
018481/0817Recorded: 11/02/2006Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
PARKER, WINSTON T.
Exec Dt:
09/19/2006
MIECZOWSKI, VAN
Exec Dt:
09/15/2006
WOOD, JIM
Exec Dt:
09/14/2006
CRONIN, DANIEL
Exec Dt:
09/18/2006
EMERSON, DAVID
Exec Dt:
10/27/2006
Assignee:
CREE, INC.
4600 SILICON DRIVE
DURHAM, NORTH CAROLINA 27706
Correspondent:
DAVID C. HALL
MYERS BIGEL SIBLEY & SAJOVEC
P.O. BOX 37428
RALEIGH NC 27627
Assignment: 2
Reel/Frame:
064185/0755Recorded: 06/30/2023Pages: 69
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
WOLFSPEED, INC.
Exec Dt:
06/23/2023
Assignee:
U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION
214 N. TRYON STREET, 27TH FLOOR
MAIL CODE CN-NC-H27A
CHARLOTTE, NORTH CAROLINA 28202
Correspondent:
NIKOLAI DOKKEDAHL
1285 AVENUE OF THE AMERICAS
PAUL WEISS RIFKIND WHARTON &GARRISON LLP
NEW YORK, NY 10019-6064

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