Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11212978
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Filing Dt:
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08/26/2005
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Publication #:
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Pub Dt:
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03/01/2007
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Inventors:
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Jay Lin, Dennis Pai, Frank Lung, Hung Tsu Chang, Men San Lung
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Title:
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Method for re-forming BGA of a semiconductor package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 84, TAIHO RD., CHUPEI |
| HSINCHU HSIEN, TAIWAN |
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| LIN-YUN CHENG |
| 20775 NORADA CT. |
| SARATOGA, CA 95070 |
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