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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11508893
Filing Dt:
08/24/2006
Publication #:
Pub Dt:
03/01/2007
Inventors:
Hirotaka Shida, Akihiro Takemura, Masayuki Hattori, Gaku Minamihaba, Dai Fukushima et al
Title:
Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devices
Assignment: 1
Reel/Frame:
018571/0016Recorded: 11/08/2006Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/02/2006
Exec Dt:
10/02/2006
Exec Dt:
10/06/2006
Exec Dt:
10/16/2006
Exec Dt:
10/16/2006
Exec Dt:
10/16/2006
Exec Dt:
10/16/2006
Exec Dt:
10/16/2006
Exec Dt:
10/16/2006
Assignees:
6-10, TSUKIJI 5-CHOME, CHUO-KU
TOKYO, JAPAN
1-1, SHIBAURA 1-CHOME, MINATO-KU
TOKYO, JAPAN
Correspondent:
OBLON, SPIVAK, MCCLELLAND, MAIER, ET AL
1940 DUKE STREET
ALEXANDRIA, VIRGINIA 22314

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