Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10554855
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Filing Dt:
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10/18/2006
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Publication #:
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Pub Dt:
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03/08/2007
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Inventors:
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Kenji Otoda, Shuichi Inoue
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Title:
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Brittle substrate cutting system and brittle substrate cutting method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-12-12, MINAMI-KANEDEN, SUITA-CITY |
| OSAKA, JAPAN 564-0044 |
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| SNELL & WILMER L.L.P. |
| ONE ARIZONA CENTER, 400 E. VAN BUREN ST |
| HOWARD I SOBELMAN |
| PHOENIX, AZ 85004-2202 |
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