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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/03/2011
Application #:
10565259
Filing Dt:
10/17/2006
Publication #:
Pub Dt:
03/08/2007
Inventors:
Michael Bauer, Thomas Bemmerl, Edward Fuergut, Simon Jerebic, Herman Vilsmeier
Title:
SUPPORT WITH SOLDER BALL ELEMENTS AND A METHOD FOR POPULATING SUBSTRATES WITH SOLDER BALLS
Assignment: 1
Reel/Frame:
018918/0867Recorded: 02/22/2007Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/10/2006
Exec Dt:
08/16/2006
Exec Dt:
08/10/2006
Exec Dt:
08/10/2006
Exec Dt:
08/21/2006
Assignee:
ST.-MARTIN-STR. 53
MUNICH, GERMANY 81669
Correspondent:
MARK L. GLEASON
FIFTH STREET TOWERS, 100 SOUTH 5TH STREE
SUITE 2250
MINNEAPOLIS, MN 55402

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