Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11511869
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Filing Dt:
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08/29/2006
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Publication #:
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Pub Dt:
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03/15/2007
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Inventors:
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Rongjun Wang, Hua Chung, Xianmin Tang, Jenn Yue Wang, Wei D. Wang, Yoichiro Tanaka et al
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Title:
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Integrated process for sputter deposition of a conductive barrier layer, especially an alloy of ruthenium and tantalum, underlying copper or copper alloy seed layer
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| APPLIED MATERIALS, INC. |
| P. O. BOX 450 A |
| SANTA CLARA, CA 95052 |
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