Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11526868
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Filing Dt:
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09/26/2006
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Publication #:
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Pub Dt:
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03/29/2007
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Inventors:
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Koji Izunome, Yumiko Hirano, Takashi Watanabe, Kazuhiko Kashima, Hiroyuki Saito et al
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Title:
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Method of manufacturing silicon wafer
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-3, OHSAKI 1-CHOME |
| SHINAGAWA-KU, TOKYO, JAPAN 141-0032 |
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| RICHARD L. SCHWAAB |
| 3000 K STREET, N.W. |
| SUITE 500 |
| WASHINGTON, DC 20007-5143 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 6-3, OHSAKI 1-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN |
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| RICHARD L. SCHWAAB |
| 3000 K STREET, N.W. |
| SUITE 500 |
| WASHINGTON, DC 20007-5143 |
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