Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/29/2011
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Application #:
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11542229
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Filing Dt:
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10/04/2006
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Publication #:
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Pub Dt:
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04/05/2007
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Inventors:
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Shigeru Tanaka, Kanji Shimoohsako, Takashi Ito, Mutsuaki Murakami
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Title:
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THERMOSETTING RESIN COMPOSITION, LAMINATED BODY USING IT, AND CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-4, NAKANOSHIMA 3-CHOME, KITA-KU, OSAKA-SHI |
| OSAKA 530-8288, JAPAN |
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| WESTERMAN HATTORI DANIELS & ADRIAN, LLP |
| 1250 CONNECTICUT AVENUE, NW |
| SUITE 700 |
| WASHINGTON, DC 20036 |
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Assignment:
2
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| 2-3-18, NAKANOSHIMA, KITA-KU |
| OSAKA, JAPAN |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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