Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11452321
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Filing Dt:
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06/14/2006
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Publication #:
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Pub Dt:
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04/05/2007
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Inventor:
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Eiji Hirata
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Title:
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Printed-wiring board, multilayer printed-wiring board and manufacturing process therefor
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-1, NISHISHINJUKU 6-CHOME, SHINJUKU-KU |
| TOKYO 163-1388, JAPAN |
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| C. IRVIN MCCLELLAND |
| OBLON, SPIVAK, MCCLELLAND, MAIER & NEUST |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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