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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10576412
Filing Dt:
04/19/2006
Publication #:
20070075372
Pub Dt:
04/05/2007
Inventors:
Koichi Terashima, Kiyoshi Takeuchi, shigeharu Yamagami, Hitoshi Wakabayashi et al
Title:
Semiconductor device and manufacturing process therefor
Assignment: 1
Reel/Frame:
017817/0309Recorded: 04/19/2006Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
TERASHIMA, KOICHI
Exec Dt:
04/12/2006
TAKEUCHI, KIYOSHI
Exec Dt:
04/12/2006
YAMAGAMI, SHIGEHARU
Exec Dt:
04/12/2006
WAKABAYASHI, HITOSHI
Exec Dt:
04/12/2006
OGURA, ATSUSHI
Exec Dt:
04/12/2006
WATANABE, KOJI
Exec Dt:
04/12/2006
TATSUMI, TORU
Exec Dt:
04/12/2006
TAKEDA, KOICHI
Exec Dt:
04/12/2006
NOMURA, MASAHIRO
Exec Dt:
04/12/2006
TANAKA, MASAYASU
Exec Dt:
04/12/2006
Assignee:
NEC CORPORATION
7-1, SHIBA 5-CHOME
MINATO-KU, TOKYO, JAPAN
Correspondent:
DAVID A. BLUMENTHAL
FOLEY & LARDNER LLP
WASHINGTON HARBOUR
3000 K STREET, N.W., SUITE 500
WASHINGTON, DC 20007-5143

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