Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/09/2010
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Application #:
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11318300
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Filing Dt:
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12/22/2005
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Publication #:
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Pub Dt:
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04/19/2007
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Inventors:
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Ming Sun, Yueh Se Ho
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Title:
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VERTICAL PACKAGED IC DEVICE MODULES WITH INTERCONNECTED 3D LAMINATES DIRECTLY CONTACTS WAFER BACKSIDE
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Assignment:
1
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CHANGE OF ASSIGNEE'S ADDRESS
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| CANNON'S COURT, 22 VICTORIA STREET |
| HAMILTON HM12, BERMUDA |
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| BO-IN LIN |
| 13445 MANDOLI DRIVE |
| LOS ALTOS HILLS, CA 94022 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 495 MERCURY DRIVE |
| SUNNYVALE, CALIFORNIA 94085 |
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| BO-IN LIN |
| 13445 MANDOLI DRIVE |
| LOS ALTOS HILLS, CA 94022 |
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