Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
2
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11510066
|
Filing Dt:
|
08/24/2006
|
Publication #:
|
|
Pub Dt:
|
04/19/2007
| | | | |
Inventors:
|
Shang-Wei Chen, Zhao-Chong Zeng, Chung-Cheng Lien, Shih-Ping Hsu
|
Title:
|
Semiconductor device with electroless plating metal connecting layer and method for fabricating the same
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
NO. 6, LI-HSIN ROAD |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN R.O.C. |
|
|
|
SAWYER LAW GROUP LLP |
P.O. BOX 51418 |
PALO ALTO, CA 94303 |
|
|
Assignment:
2
|
|
|
|
CORRECTIVE ASSIGNMENT TO CORRECT THE 1, 2, 3 CONVEYING PARTIES, THE ASSIGNEE'S ADDRESS AND THE DOCKET NUMBER ON THE ASSIGNMENT, PREVIOUSLY RECORDED ON REEL 018244 FRAME 0072.
|
|
|
|
|
|
NO. 6, LI-HSIN ROAD, SCIENCE BASED-INDUSTRIAL PARK |
HSIN-CHU, TAIWAN (R.O.C.) |
|
|
|
SAWYER LAW GROUP LLP |
P.O. BOX 51418 |
PALO ALTO, CA 94303 |
|
|
Search Results as of:
04/30/2024 06:07 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|