Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11509876
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Filing Dt:
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08/24/2006
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Publication #:
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Pub Dt:
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04/19/2007
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Inventors:
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Shang Wei Chen, Zhao Chong Zeng, Chung Cheng Lien, Shih Ping Hsu
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Title:
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Wafer structure with electroless plating metal connecting layer and method for fabricating the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6, LI-HSIN ROAD, SCIENCE-BASED |
| INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN R.O.C. |
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| SAWYER LAW GROUP LLP |
| P.O. BOX 51418 |
| PALO ALTO, CA 94303 |
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