Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11583999
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Filing Dt:
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10/19/2006
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Publication #:
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Pub Dt:
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04/26/2007
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Inventors:
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Robert C. Daigle, Amit Das, Sankar K. Paul, Dirk M. Baars, Allen F. Horn III
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Title:
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Circuit board materials with improved bond to conductive metals and methods of the manufacture thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7366 NORTH LINCOLN AVENUE |
| SUITE 410 |
| LINCOLNWOOD, ILLINOIS 60712 |
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| CANTOR COLBURN |
| 55 GRIFFIN ROAD SOUTH |
| LEAH M. REIMER |
| BLOOMFIELD, CT 06002 |
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