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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
7504018
Issue Dt:
03/17/2009
Application #:
11554928
Filing Dt:
10/31/2006
Publication #:
20070095677
Pub Dt:
05/03/2007
Inventors:
You Wang, Stan D. Tsai, Alpay Yilmaz, Lakshmanan Karuppiah, Jie Diao, Renhe Jia
Title:
ELECTROCHEMICAL METHOD FOR ECMP POLISHING PAD CONDITIONING
Assignment: 1
Reel/Frame:
018752/0701Recorded: 01/12/2007Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WANG, YOU
Exec Dt:
12/15/2006
TSAI, STAN D.
Exec Dt:
12/14/2006
KARUPPIAH, LAKSHMANAN
Exec Dt:
12/12/2006
DIAO, JIE
Exec Dt:
12/12/2006
JIA, RENHE
Exec Dt:
12/12/2006
YILMAZ, ALPAY
Exec Dt:
12/12/2006
Assignee:
APPLIED MATERIALS, INC.
P. O. BOX 450A
SANTA CLARA, CALIFORNIA 95052
Correspondent:
APPLIED MATERIALS
P.O. BOX 450A
SANTA CLARA, CA 95052

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