Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11529635
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Filing Dt:
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09/28/2006
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Publication #:
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Pub Dt:
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05/03/2007
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Inventors:
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Kunio Watanabe, Tomo Takaso, Masahiro Hayashi, Takahisa Akiba, Susumu Kenmochi
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Title:
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Semiconductor Integrated Circuit Device Having Interconnect Layers
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1 NISHI-SHINJUKU 2-CHOME |
| SHINJUKU-KU |
| TOKYO, JAPAN 163-0811 |
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| G. GREGORY SCHIVLEY |
| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 828 |
| BLOOMFIELD HILLS, MI 48303 |
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