Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11262863
|
Filing Dt:
|
10/31/2005
|
|
Publication #:
|
|
Pub Dt:
|
05/03/2007
| | | | |
|
Inventors:
|
William D. Sawyer, Jonathan J. Bernstein
|
|
Title:
|
Hard intermetallic bonding of wafers for MEMS applications
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 555 TECHNOLOGY SQUARE |
| CAMBRIDGE, MASSACHUSETTS 02139 |
|
|
|
|
| MCDERMOTT WILL & EMERY LLP |
| ATTN: INTELLECTUAL PROPERTY DEPTARTMENT |
| 28 STATE STREET |
| BOSTON, MA 02109 |
|
|
Search Results as of:
05/27/2024 09:50 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
