Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11595979
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Filing Dt:
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11/13/2006
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Publication #:
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Pub Dt:
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05/17/2007
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Inventors:
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Hiroyuki Uematsu, Toshinobu Miyakoshi, Hisashi Kobuke
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Title:
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Composite wiring board and manufacturing method thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 13-1 NIHONBASHI 1-CHOME, CHUO-KU |
| TOKYO, JAPAN |
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| KANESAKA BERNER & PARTNERS |
| PATENT AGENTS, LLP |
| 1700 DIAGONAL ROAD, SUITE 310 |
| ALEXANDRIA, VA 22314 |
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