Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/06/2009
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Application #:
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11598672
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Filing Dt:
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11/14/2006
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Publication #:
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Pub Dt:
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05/17/2007
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Inventors:
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Byoung Hwa Lee, Hae Suk Chung, Dong Seok Park, Min Cheol Park, Sang Soo Park et al
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Title:
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MULTILAYER CHIP CAPACITOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AVENUE NESTLE 55 |
| CH-1800 VEVEY, SWITZERLAND |
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| ROBERT M. BARRETT, ESQ. |
| BELL, BOYD & LLOYD LLC |
| P.O. BOX 1135 |
| CHICAGO, ILLINOIS 60690-1135 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314 MAETAN-3-DONG, YOUNGTONG-KU |
| SUWON, KYUNGKI-DO, KOREA, REPUBLIC OF |
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| MCDERMOTT WILL & EMERY LLP |
| 600 13TH STREET, N.W. |
| WASHINGTON, D.C. 20005-3096 |
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