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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10555455
Filing Dt:
01/12/2007
Publication #:
Pub Dt:
05/17/2007
Inventors:
Yu-Ling Cheng, Michael H. May, John L. Semple, Hai-Hui Lin
Title:
Thermally reversible implant
Assignment: 1
Reel/Frame:
018758/0115Recorded: 01/15/2007Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/06/2006
Exec Dt:
10/25/2006
Exec Dt:
10/10/2006
Exec Dt:
10/18/2006
Assignee:
59 ADELAID STREET EAST
TORONTO, CANADA M5C 1K6
Correspondent:
BORDEN LADNER GERVAIS LLP
100 QUEEN STREET, SUITE 1100
WORLD EXCHANGE PLAZA
OTTAWA, K1P 1J9 CANADA

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