Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10555455
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Filing Dt:
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01/12/2007
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Publication #:
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Pub Dt:
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05/17/2007
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Inventors:
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Yu-Ling Cheng, Michael H. May, John L. Semple, Hai-Hui Lin
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Title:
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Thermally reversible implant
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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59 ADELAID STREET EAST |
TORONTO, CANADA M5C 1K6 |
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BORDEN LADNER GERVAIS LLP |
100 QUEEN STREET, SUITE 1100 |
WORLD EXCHANGE PLAZA |
OTTAWA, K1P 1J9 CANADA |
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