Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/07/2010
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Application #:
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11273108
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Filing Dt:
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11/12/2005
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Publication #:
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Pub Dt:
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05/17/2007
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Inventors:
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Yeow Kheng Lim, Wei Lu, Liang Choo Hsia, Jyoti Gupta, Hao Zhang, Chim Seng Seet
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Title:
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FORMATION OF METAL SILICIDE LAYER OVER COPPER INTERCONNECT FOR RELIABILITY ENHANCEMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 60 WOODLANDS INDUSTRIAL PARK D, STREET TWO |
| SINGAPORE, SINGAPORE 738406 |
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| WILLIAM J. STOFFEL |
| 1735 MARKET ST. - STE A455 |
| PHILADELPHIA, PA 19103 |
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