Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11600694
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Filing Dt:
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11/16/2006
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Publication #:
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Pub Dt:
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05/24/2007
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Inventors:
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Johann Helneder, Manfred Schneegans, Holger Torwesten
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Title:
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Interconnecting element between semiconductor chip and circuit support and method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ST.-MARTIN-STR. 53 |
| MUNICH, GERMANY 81669 |
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| DICKE, BILLIG & CZAJA, P.L.L.C. |
| FIFTH STREET TOWERS |
| 100 SOUTH FIFTH STREET, SUITE 2250 |
| MINNEAPOLIS, MN 55402 |
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