Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/08/2011
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Application #:
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11290899
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Filing Dt:
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11/30/2005
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Publication #:
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Pub Dt:
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05/31/2007
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Inventors:
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Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth JR., Madhusudan K. Iyengar et al
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Title:
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REDUNDANT ASSEMBLY FOR A LIQUID AND AIR COOLED MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| LILY NEFF |
| IBM CORPORATION - P386 |
| INTELLECTUAL PROPERTY LAW |
| 2455 SOUTH ROAD |
| POUGHKEEPSIE, NY 12601 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 979 KING'S ROAD |
| 23/F LINCOLN HOUSE, TAIKOO PLACE |
| QUARRY BAY, HONG KONG |
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| OBLON, SPIVAK, ET AL. |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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