Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11342188
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Filing Dt:
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01/27/2006
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Publication #:
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Pub Dt:
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05/31/2007
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Inventors:
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Jung Ku Lee, Hyun Bum Sung, Hae Bal Lee, Jung Ju Moon, Kang Yong Lee
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Title:
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Two-step high bottleneck type capillary for wire bonding device
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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168-22 SAMSUNG-DONG, GANGNAM-GU |
SEOUL 135-280, KOREA, REPUBLIC OF |
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PETER T. KWON |
GWIPS |
P.O. BOX 231630 |
CENTREVILLE, VIRGINIA 20120 |
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05/08/2024 01:08 AM
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