Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11290756
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Filing Dt:
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11/30/2005
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Publication #:
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Pub Dt:
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05/31/2007
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Inventors:
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Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth JR., Madhusudan K. Iyengar et al
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Title:
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Heat transfer apparatus, cooled electronic module and methods of fabrication thereof employing thermally conductive composite fins
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| KEVIN P. RADIGAN, ESQ. |
| HESLIN ROTHENBERG FARLEY, ET AL. |
| 5 COLUMBIA CIRCLE |
| ALBANY, NY 12203 |
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