Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11294135
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Filing Dt:
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12/03/2005
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Publication #:
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Pub Dt:
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06/07/2007
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Inventors:
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Cheng Lin, Hua-Hsin Su, Masami Nei
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Title:
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High-power LED chip packaging structure and fabrication method thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1F, NO. 384, LIANCHENG RD. |
| ZHONGHE CITY |
| TAIPEI COUNTY, TAIWAN |
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| JASON Z. LIN |
| SUPREME PATENT SERVICES |
| POST OFFICE BOX 2339 |
| SARATOGA, CA 95070 |
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