Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11559266
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Filing Dt:
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11/13/2006
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Publication #:
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Pub Dt:
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06/07/2007
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Inventors:
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Masayoshi DATE, Masaru FUJIYOSHI
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Title:
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SOLDER ALLOY, SOLDER BALL, AND SOLDER JOINT USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1, SHIBAURA 1-CHOME, |
| MINATO-KU, |
| TOKYO, JAPAN |
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| PETER D. OLEXY |
| 2100 PENNSYLVANIA AVENUE NW |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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