Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/17/2010
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Application #:
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10562235
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Filing Dt:
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10/31/2006
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Publication #:
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Pub Dt:
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06/07/2007
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Inventors:
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Syouji Nogami, Yukichi Horioka, Shoichi Yamauchi
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Title:
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MANUFACTURING METHOD OF SEMICONDUCTOR WAFER HAVING A TRENCH STRUCTURE AND EPITAXIAL LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1, SHIBAURA 1-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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| 1-1, SHOWA-CHO |
| KARIYA-SHI, AICHI, JAPAN |
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| JULES E. GOLDBERG, REED SMITH LLP |
| 599 LEXINGTON AVENUE, 29TH FLOOR |
| NEW YORK, NY 10022 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1, SHIBAURA 1-CHOME |
| MINATO-KU |
| TOKYO, JAPAN |
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| JULES E. GOLDBERG |
| 599 LEXINGTON AVENUE |
| REED SMITH LLP, 29TH FLOOR |
| NEW YORK, NY 10022 |
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