Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11441095
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Filing Dt:
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05/26/2006
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Publication #:
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Pub Dt:
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06/21/2007
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Inventors:
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Ming-Nan Hsiao, Shin-Chuan Chiang, Bor-Chuan Chuang
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Title:
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Direct patterning method for manufacturing a metal layer of a semiconductor device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| RM. 282, BLDG. 15, 195, SEC. 4, CHUNG HSING RD. |
| CHUTUNG, HSINCHU, TAIWAN R.O.C. |
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| 1127, HOPON RD., PADEH CITY |
| TAOYUAN, TAIWAN R.O.C. |
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| NO. 1, LI-HSIN 2ND RD. |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C. |
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| NO. 189, WEN HWA 2ND RD., KUEI SHAN HSIANG |
| TAO YUAN SHIEN, TAIWAN R.O.C. |
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| 5F, NO. 115, SEC. 3, MIN SHENG E. RD. |
| TAO YUAN SHIEN, TAIWAN R.O.C. |
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| NO. 1, CHI-YEH ROAD |
| SCIENCE-BASED INDUSTRIAL PARK |
| TAINAN, TAIWAN R.O.C. |
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| ERSO/ITRI 195, SEC. 4, CHUNG HSING RD., CHUTUNG |
| HSINCHU, TAIWAN R.O.C. |
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| NO.12, KA-CHUNG ROAD, CHU-NAN |
| MIAO-LI COUNTY, TAIWAN R.O.C. |
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| RABIN & BERDO, PC |
| 1101 14TH STREET, NW |
| SUITE 500 |
| WASHINGTON, DC 20005 |
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