Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/13/2008
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Application #:
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11432632
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Filing Dt:
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05/12/2006
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Publication #:
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Pub Dt:
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06/28/2007
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Inventors:
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Chun-Hao Chang, Shih-Chieh Liao, Guo-Shing Huang, Wei-Yu Chen, Chuan-Sheng Zhuang
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Title:
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WAFER BONDING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG |
| HSINCHU, TAIWAN R.O.C. |
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| TROXELL LAW OFFICE PLLC |
| 5205 LEESBURG PIKE, SUITE 1404 |
| FALLS CHURCH, VA 22041 |
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