Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11643959
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Filing Dt:
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12/22/2006
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Publication #:
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Pub Dt:
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06/28/2007
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Inventors:
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Mitsuaki Iwashita, Hidetami Yaegashi, Kenichi Hara
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Title:
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Method of repairing seed layer for damascene interconnects
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-6, AKASAKA 5-CHOME |
| MINATO-KU, TOKYO-TO, JAPAN |
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| SMITH, GAMBRELL & RUSSELL |
| 1850 M STREET, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20036 |
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