Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11322297
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Filing Dt:
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12/29/2005
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Publication #:
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Pub Dt:
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07/12/2007
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Inventors:
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Daoqiang Lu, Wei Shi, Qing Zhou, Jiangqi He
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Title:
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Edge interconnects for die stacking
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BLVD. |
SANTA CLARA, CALIFORNIA 95052 |
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DAVID W. VICTOR |
KONRAD RAYNES & VICTOR, LLP |
315 S. BEVERLY DRIVE, SUITE 210 |
BEVERLY HILLS, CA 90212 |
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