Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/19/2008
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Application #:
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11323512
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Filing Dt:
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12/30/2005
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Publication #:
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Pub Dt:
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07/12/2007
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Inventors:
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Ashay A. Dani, Anna M. Prakash, Saikumar Jayaraman, Mitesh Patel, Vijay S. Wakharkar
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Title:
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CHIP PACKAGE THERMAL INTERFACE MATERIALS WITH DIELECTRIC OBSTRUCTIONS FOR BODY-BIASING, METHODS OF USING SAME, AND SYSTEMS CONTAINING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95052 |
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| ANN M. MCCRACKIN |
| SHWEGMAN, LUNDBERG, WOESSNER ET AL. |
| P.O. BOX 2938 |
| MINNEAPOLIS, MN 55402 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95052 |
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| ANN M. MCCRACKIN |
| SCHWEGMAN LUNDBERG WOESSNER, ET AL. |
| P.O. BOX 2938 |
| MINNEAPOLIS, MN 55402 |
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