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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11467296
Filing Dt:
08/25/2006
Publication #:
Pub Dt:
07/12/2007
Inventor:
Shih-Ping Hsu
Title:
Circuit Board with Conductive Structure and Method for Fabricating the same
Assignment: 1
Reel/Frame:
018175/0051Recorded: 08/25/2006Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/01/2006
Assignee:
NO. 6, LI-HSIN ROAD
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN
Correspondent:
M. JOHN CARSON - FULBRIGHT & JAWORSKI LL
555 SOUTH FLOWER STREET, FORTY-FIRST FLR
ATTY. DKT. LA-7452-115/10610923
LOS ANGELES, CA 90071

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