Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/01/2013
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Application #:
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11652462
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Filing Dt:
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01/11/2007
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Publication #:
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Pub Dt:
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07/19/2007
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Inventors:
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Makoto Tai, Shu Dobashi
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Title:
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Polyamideimide resin for flexible printed circuit boards; metal-clad laminate, coverlay, and flexible printed circuit board that use this resin; and resin composition
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5-5, MINAMI-HONCHO 1-CHOME |
JOETSU-SHI, NIIGATA, JAPAN 943-8610 |
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BRIAN C. RUPP |
DRINKER BIDDLE & REATH LLP |
191 N. WACKER DRIVE |
SUITE 3700 |
CHICAGO, IL 60606-1698 |
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