Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10591580
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Filing Dt:
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09/05/2006
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Publication #:
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Pub Dt:
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07/26/2007
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Inventors:
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Takuo Watanabe, Yu Matsumoto
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Title:
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Heat-resistant resin laminated film, multilayer film with metal layer including same and semiconductor device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, NIHONBACHI MUROMACHI 2-CHOME |
| CHUO-KU, TOKYO 103-8666, JAPAN |
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| BARRY E. BRETSCHNEIDER |
| MORRISON & FOERSTER LLP |
| 1650 TYSONS BLVD., SUITE 300 |
| MCLEAN, VA 22102 |
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