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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11337985
Filing Dt:
01/24/2006
Publication #:
Pub Dt:
07/26/2007
Inventors:
Masazumi Amagai, Masako Watanabe
Title:
Flip-attached and underfilled stacked semiconductor devices
Assignment: 1
Reel/Frame:
017509/0521Recorded: 04/19/2006Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/23/2006
Exec Dt:
03/30/2006
Assignee:
P.O. BOX 655474, MS 3999
DALLAS, TEXAS 75265
Correspondent:
YINGSHENG TUNG
TEXAS INSTRUMENTS INCORPORATED
P.O. BOX 655474, MS 3999
DALLAS, TX 75265

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