Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/11/2011
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Application #:
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10561550
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Filing Dt:
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02/23/2007
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Publication #:
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Pub Dt:
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08/02/2007
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Inventors:
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Hideji Tajima, Yukiko Miyashita, Osamu Segawa
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Title:
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SAMPLE ARRAYING/ASSEMBLING DEVICE, ITS METHOD, AND APPARATUS USING SAMPLE ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 88, KAMIHONGOU, MATSUDO-SHI |
| CHIBA, JAPAN 271-0064 |
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| ALAN N. HERDA |
| HAYNES AND BOONE, LLP |
| 901 MAIN STREET, SUITE 3100 |
| DALLAS, TX 75202 |
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