Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10598124
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Filing Dt:
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08/18/2006
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Publication #:
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Pub Dt:
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08/09/2007
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Inventors:
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Isao Sakamoto, Junichi Onozaki, Masahiko Furuno, Hiroshi Saito, Haruhiko Ando et al
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Title:
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Solder composition and method of bump formation therewith
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-19-43, HIGASHI-OIZUMI, NERIMA-KU |
| TOKYO, JAPAN |
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| 4-1-8, HONCHO, KAWAGUCHI-SHI, |
| SAITAMA, JAPAN |
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| GREENBLUM & BERNSTEIN, P.L.C. |
| 1950 ROLAND CLARKE PLACE |
| RESTON, VA 20191 |
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