Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/01/2011
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Application #:
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11668974
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Filing Dt:
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01/30/2007
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Publication #:
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Pub Dt:
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08/09/2007
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Inventors:
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Kenji UCHIDA, Koki Hirasawa, Katsumi Shimada, Shinya Ota, Shinjiro Uenishi
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Title:
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TRANSPARENT EPOXY RESIN COMPOSITION FOR MOLDING OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, |
| KANAGAWA, JAPAN 211-8668 |
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| 2-1, SHIMOHOZUMI, 1-CHOME, IBARAKI-SHI, |
| OSAKA, JAPAN 567-8680 |
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| HOWARD L. BERNSTEIN |
| 2100 PENNSYLVANIA AVENUE, NW |
| WASHINGTON, DC 20037 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONUMABE, NAKAHARA-KU, |
| KAWASAKI-SHI, KANAGAWA, JAPAN 211-8668 |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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Assignment:
3
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| 2-24, TOYOSU 3-CHOME, KOUTOU-KU |
| TOKYO, JAPAN |
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| MATTINGLY & MALUR, PC |
| 1800 DIAGONAL ROAD |
| SUITE 210 |
| ALEXANDRIA, VA 22314 |
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