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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/09/2008
Application #:
11620784
Filing Dt:
01/08/2007
Publication #:
Pub Dt:
08/09/2007
Inventors:
Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober
Title:
SEMICONDUCTOR COMPONENT COMPRISING FLIP CHIP CONTACTS WITH POLYMER CORES AND METHOD OF PRODUCING THE SAME
Assignment: 1
Reel/Frame:
019119/0724Recorded: 04/05/2007Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/12/2007
Exec Dt:
01/12/2007
Exec Dt:
01/12/2007
Exec Dt:
01/12/2007
Exec Dt:
01/12/2007
Assignee:
ST.-MARTIN-STR. 53
MUNICH, GERMANY 81669
Correspondent:
PATRICK FINNAN (EDELL, SHAPIRO & FINNAN)
1901 RESEARCH BLVD.
SUITE 400
ROCKVILLE, MD 20850

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