Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11349566
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Filing Dt:
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02/08/2006
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Publication #:
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Pub Dt:
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08/09/2007
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Inventors:
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John Melvyn Cullen, Suzanne Combe
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Title:
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Method of bonding a semiconductor wafer to a support substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HEIGHINGTON LANE BUSINESS PARK |
| NEWTON AYCLIFFE, COUNTY DURHAM, UNITED KINGDOM DL5 6JW |
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| SAMUEL J. HAIDLE |
| HOWARD & HOWARD ATTORNEYS, P.C. |
| 39400 WOODWARD AVENUE, SUITE 101 |
| BLOOMFIELD HILLS, MICHIGAN 48304-5151 |
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Assignment:
2
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CORRECTED COVER SHEET TO CORRECT ASSIGNEE'S NAME, PREVIOUSLY RECORDED AT REEL/FRAME 017836/0526 (ASSIGNMENT OF ASSIGNOR'S INTEREST)
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| HEIGHINGTON LANE BUSINESS PARK |
| NEWTON AYCLIFFE, COUNTY DURHAM, UNITED KINGDOM DL5 6JW |
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| SAMUEL J. HAIDLE |
| HOWARD & HOWARD ATTORNEYS, P.C. |
| 39400 WOODWARD AVENUE, SUITE 101 |
| BLOOMFIELD HILLS, MI 48304-5151 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| HEIGHINGTON LANE BUSINESS PARK |
| NEWTON AYCLIFFE, COUNTY DURHAM, UNITED KINGDOM DL5 6JW |
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| WITHROW & TERRANOVA, PLLC |
| 100 REGENCY FOREST DRIVE |
| SUITE 160 |
| CARY, NC 27518 |
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