Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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03/01/2011
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Application #:
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11117414
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Filing Dt:
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04/29/2005
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Publication #:
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Pub Dt:
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08/16/2007
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Inventors:
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Alexander Kilthau, Hans Juergen Mayer, Marc Van Biesen
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Title:
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METHOD FOR DRILLING HOLES IN A SUBSTRATE, IN PARTICULAR AN ELECTRICAL CIRCUIT SUBSTRATE, BY MEANS OF A LASER BEAM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| WITTELSBACHERPLATZ 2 |
| MUNICH, GERMANY D-80333 |
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| SIEMENS SCHWEIZ |
| I-44, INTELLECTUAL PROPERTY |
| ALBISRIEDERSTRASSE 245 |
| ZURICH, SWITZERLAND CH-8047 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2100 KAMIIMAIZUMI |
| EBINA-SHI KANAGAWA, JAPAN 243-0488 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 8910 |
| RESTON, VA 20195 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 2100, KAMIIMAIZUMI |
| EBINA-SHI, KANAGAWA, JAPAN |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVE. NW |
| SUITE 800 |
| WASHINGTON, DC 20037-3213 |
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