Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11353068
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Filing Dt:
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02/14/2006
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Publication #:
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Pub Dt:
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08/16/2007
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Inventors:
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Yi-Cheng Chen, Chun-Ping Hu, Chien-Wen Tsai
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Title:
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Patterned gold bump structure for semiconductor chip
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.12, INNOVATION 1ST,RD., SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU CITY, TAIWAN |
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| G. LINK CO.,LTD. |
| 3550 BELL ROAD |
| MINOOKA, IL 60447 |
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